Written by: David Duross on July 31, 2009.
Last revised by: David Duross on November 4, 2011.

There are many benefits to Electroless Nickel Immersion Gold (ENIG). The first benefit is a very flat and level surface to solder to. This makes ENIG ideal for fine pitch surface mount devices. Another benefit is that the nickel strengthens the structure of the plated through hole. There are some drawbacks to ENIG. ENIG is an unforgiving process. Once the coating is applied there is no going back. Techniques that could be used to remove the finish are also damaging to the copper. Tight chemical and process controls need to be in place at printed circuit board manufacturers in order to provide a quality coating of ENIG per IPC-4552. Defects with the ENIG plating process may not be discovered until

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