Written by: David Duross on August 1, 2009.
Last revised by: David Duross on November 4, 2011.

Immersion silver is a solderable surface finish applied to the bare copper of a printed circuit board. The role of the immersion silver is to prevent the copper from oxidizing. When soldering to a board with immersion silver a copper-tin intermetalic alloy is formed. The silver is absorbed into the solder joint. Immersion silver is applied as a last operation. It is common for it to be applied to individual boards in piece or pallet form after the parts have been removed from the process panel. This minimized handling contamination and visual defects to the plated surface.

Immersion Silver has the following advantages…

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