Written by: David Duross on August 8, 2009.
Last revised by: David Duross on November 4, 2011.

As with any baking operation it is important to realize that the surface finish shall start to oxidize. There are many bake operations employed in printed circuit board manufacturing. When bare copper is baked at 300  deg F for an hour the copper turns color. The copper has become oxidized and must be cleaned prior to continued processing. The final solderable finish shall oxidize as well when exposed to heat. At the time of this posting the IPC and its members are currently working on a specification that deals directly with baking of printed circuit boards. The preliminary specification can be found posted on the IPC web site at…

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