Envision HDI is an alternative copper deposition process that just works. Deposition or metalization is the basic foundation of a plated through hole structure. The deposition material makes a drilled hole conductive enough to allow copper to be electroplated within the drilled hole. Without metalization there would be no plated through hole. Of course there are several different chemicals available to metalize a non-conductive surface.
Electroless copper deposition was the original chemical process employed by the pcb industry to form this conductive layer. There were many downsides to this process. Chemical cost, time of operation and waste treatment to name just a few. Some of the chemicals used in the overall process are highly toxic. The process has been improved over the years.
Copper deposition was the only option for a number of years until (more…)