What damage does the assembly process do to a pcb? (part 3)
In part 2 of this post I explained how the T260 and T288 material data sheet values could be used as an indicator of how durable a laminate system (FR-4) shall be when exposed to heat. The higher the temperature applied the less time it takes to delaminate the FR-4. Traditional dicey cured epoxy systems do not stand up to lead-free assembly temperatures as well as one would think. The newer phenolic cured epoxy systems are much better suited and able to withstand the higher temperatures applied with lead-free assembly techniques.
GREAT! PROBLEM SOLVED!
The remaining content is restricted to registered site members only.
MEMBERSHIP IS FREE!!!
If you are an existing user, please login.
New users may register below. Please register with a valid email address since we shall be emailing your login password to you.
Tags: Assembly, cratering, cured, delamination, dicey, Flexural, haloing, pad, Peel, phenolic, Strength