What damage does the assembly process do to a pcb? (part 5)
With regards to sources of moisture, in part 4 of this series I comment upon a practice where some printed circuit board manufacturers shall dry bake the printed circuit boards prior to shipping them. The important thing to add here is that common packaging materials used by the industry do not act as a 100% vapor barrier. The shrink wrap film used only slows down the process of moisture absorption by the product. Moisture in the environment outside the bag shall migrate through the protective film but at a much slower rate. Things to consider are as follows…
The remaining content is restricted to registered site members only.
MEMBERSHIP IS FREE!!!
If you are an existing user, please login.
New users may register below. Please register with a valid email address since we shall be emailing your login password to you.