Over the past 15 years we have seen some very amazing advancements in technology. Our electronic devices have become smaller, faster and more powerful. The capabilities of these new devices have brought science fiction to life for many of us. What the common consumer does not realize is that these advancements have occurred in a more destructive Lead-Free assembly process. Lead Free assembly methods consisting of higher assembly temperatures (around 260ºC) for longer dwell times at temperature along with a smaller processing window for success. The assembly methods today are challenged to not only maintain yields but to improve them. All the while cutting costs where ever possible. The desire to cut cost is where we see the result of unintended consequences.

I have been asked repeatedly by customers for my opinion on methods to improve yields. I evaluate designs and work with designers and assemblers on solutions to help them improve yields. This includes in process and post process yields. In other words build it right the first time and make sure it lasts in the field. A common question I am asked by customers is…

What is the one thing that we can do that can  improve our yields?

The answer is very simple…

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