Archive for the ‘04 Dry Film Lamination’ Category

Dry Film Lamination (history)

Sunday, September 23rd, 2012

Dry film is commonly used in the printed circuit board industry in the formation of circuitry on both inner layers and outer layers of a printed circuit board. Dry Film acts as a resist to either plating or etching chemistry. In order to understand and appreciate the current process (and how it came about) I’ll begin by explaining some of the history behind the process commonly used today. Many of the operations used by the printed circuit board industry originated (more…)