Posts Tagged ‘BGA’

Simple Yield Improvement. (Part 2)

Sunday, January 6th, 2013

In the previous post we discussed what happens to the printed circuit board structure when it is heated. We discussed how different materials expand at different rates and the effect the expansion rates have on the warp and twist of a Printed Circuit Board (PCB). We also discussed how moisture absorption can increase the degree of warp and twist and the adverse effect it has on assembly yields and potential field failures. We also discussed how dry baking removes moisture from the PCB and how it minimizes if not eliminates potential problems.

In this post we shall discuss the stabilizing effect that (more…)