Posts Tagged ‘laminate’

Simple Yield Improvement. (Part 2)

Sunday, January 6th, 2013

In the previous post we discussed what happens to the printed circuit board structure when it is heated. We discussed how different materials expand at different rates and the effect the expansion rates have on the warp and twist of a Printed Circuit Board (PCB). We also discussed how moisture absorption can increase the degree of warp and twist and the adverse effect it has on assembly yields and potential field failures. We also discussed how dry baking removes moisture from the PCB and how it minimizes if not eliminates potential problems.

In this post we shall discuss the stabilizing effect that (more…)

Material Allocation

Wednesday, April 27th, 2011

What does it take to build a circuit board? For starters you can’t build a printed circuit board without materials. What types of materials to be used are defined by the customer supplied documentation and or by the methods/release engineer. If requirements are not specified by the customer the methods/release engineer shall default to IPC standards. The various manufacturing operations used are a series of added and subtractive processes. All of which are determined by the methods/release engineer. It takes many different types of chemicals and materials to fabricate the printed circuit board. The most important material is what we start with and that’s the base copper clad laminate.

Base laminate is typically copper clad FR4. FR4 is a composite material consisting of (more…)