Posts Tagged ‘phenolic’

Simple Yield Improvement. (Part 2)

Sunday, January 6th, 2013

In the previous post we discussed what happens to the printed circuit board structure when it is heated. We discussed how different materials expand at different rates and the effect the expansion rates have on the warp and twist of a Printed Circuit Board (PCB). We also discussed how moisture absorption can increase the degree of warp and twist and the adverse effect it has on assembly yields and potential field failures. We also discussed how dry baking removes moisture from the PCB and how it minimizes if not eliminates potential problems.

In this post we shall discuss the stabilizing effect that (more…)

What damage does the assembly process do to a pcb? (part 3)

Sunday, August 21st, 2011

In part 2 of this post I explained how the T260 and T288 material data sheet values could be used as an indicator of how durable a laminate system (FR-4) shall be when exposed to heat. The higher the temperature applied the less time it takes to delaminate the FR-4. Traditional dicey cured epoxy systems do not stand up to lead-free assembly temperatures as well as one would think. The newer phenolic cured epoxy systems are much better suited and able to withstand the higher temperatures applied with lead-free assembly techniques.


Not exactly. (more…)