Posts Tagged ‘RoHS’

Simple Yield Improvement. (Part 1)

Monday, December 31st, 2012

Over the past 15 years we have seen some very amazing advancements in technology. Our electronic devices have become smaller, faster and more powerful. The capabilities of these new devices have brought science fiction to life for many of us. What the common consumer does not realize is that these advancements have occurred in a more destructive Lead-Free assembly process. Lead Free assembly methods consisting of higher assembly temperatures (around 260ºC) for longer dwell times at temperature along with a smaller processing window for success. The assembly methods today are challenged to not only maintain yields but to improve them. All the while cutting costs where ever possible. The desire to cut cost is where we see the result of unintended consequences.

I have been asked repeatedly by customers for my opinion on methods to improve yields. I evaluate designs and work with designers and assemblers on solutions to help them improve yields. This includes in process and post process yields. In other words build it right the first time and make sure it lasts in the field. A common question I am asked by customers is…

What is the one thing that we can do that can  improve our yields?

The answer is very simple… (more…)

Compliance Requirements for 2013.

Saturday, November 10th, 2012

Over the past few years the printed circuit board industry has had numerous regulatory and compliance initiatives forced upon it. Some of these may have been well intentioned but the unintended results have yet to be realized. For example, many of us are familiar with RoHS, Restriction of Hazardous Substances directive. The directive restricts the use of several substances by manufacturers. The only substance restriction that really affected the printed circuit board industry was Lead. Tin-Lead solder was used in the industry for decades. RoHS sought to remove Lead from the electronics industry. Many people recall how harmful Lead in gasoline and paint proved to be to both the environment and the human condition. Removing Lead from electronics would sound like a good idea. Right? (more…)

RoHS vs. Lead Free Assembly

Saturday, January 17th, 2009

It is easy to mis-interpret the relationship between RoHS and Lead Free Assembly. Lead Free Assembly has been around for decades in limited applications. RoHS came about when the European Union passed a directive known as WEEE. WEEE or Waste of Electrical and Electronic Equipment (2002/96/EWG) regulates the end of life disposal and recycling of electrical waste. The legislation states that producers are responsible for waste and financing its collection. Users from private households should be allowed to recycle products free of charge. To reduce recycling costs the restricted or banned materials, manufacturers are striving to remove these substances from their product. This is where RoHS comes in.

RoHS or Restriction of Hazardous Substances (2002/95/EWG) prohibits the use of the following substances: (more…)