Posts Tagged ‘tin lead’

What damage does the assembly process do to a pcb? (part 1)

Wednesday, August 17th, 2011

A colleague contacted me the other day with a topic that would make an excellent post on this blog.

“How can we solder boards with a Tg of 180°C or even 200°C at temperatures of 225-245°C without damaging the board?  Even with leaded boards the peak reflow temperatures are way above the board’s Tg.  How is this possible?”

The answer is simple. Every time a printed circuit board is exposed to soldering temperatures it becomes damaged. This is the case not only for Lead-Free soldering applications but also for eutectic soldering consisting of tin-lead.

Tg is one of several parameters to be aware of. In the case of Tg most designers refer to the value as (more…)