Advanced EMC Course

The Advanced EMC Course covers the Advanced techniques generally needed in 2023 for high-speed digital circuits. The Advanced EMC Course is suitable for experienced designers who have already completed the PCB Design School's Essential EMC course.

Every two years, on average, every type of semiconductor that is available on the market goes through a die-shrink, which makes their emissions and immunity worse. This applies to older device types, like 74-series TTL and HCMOS, as well as to the latest microprocessors, FPGAs and memories, so designing with the same old parts does not protect us from this problem. So PCB design techniques must continually advance for us to design PCBs in a way that doesn’t cause Signal Integrity (SI), Power Integrity (PI) or electromagnetic compatibility (EMC) problems.

Special PCB design/layout techniques are generally needed when resonances in PCB structures are excited by the frequencies present in the analogue, digital or power supply current waveforms. Such techniques are becoming increasingly essential for all PCBs that use high-speed processing or data, and are covered in this course.

The course covers many subjects including:

• When should we use advanced PCB techniques?
• Future trends and their implications
• Guidelines, approximations, simulations, and virtual design for SI, PI and EMC
• Advanced EM Zoning (segregation) techniques
• Advanced interface filtering and suppression, including using board-level shielding and Metamaterials to 60+ GHz
• Advanced RF-bonding for PCB Reference Planes at EM Zone boundaries
• Advanced PCB planes (and co-locating radio/TV/wireless datacom antennas)
• The totally shielded board assembly
• Damping the resonances in parallel metal structures, including Metamaterial methods e.g. Virtual Ground Fence; EBG (Electromagnetic Band Gap); HIS (High Impedance Surface), Split-Ring Resonators, etc.
• Advanced PCB power supply decoupling
• Buried components (especially buried capacitance decoupling)
• Advanced transmission lines, up to at least 32Gb/s
• Microvia (i.e. high density interconnect, HDI) board techniques
• Future developments, including: a) 3D Moulded PCBs; b) Additive Manufacturing of PCBs; c) Replacing PCBs with ‘SIF’ (Silicon Interconnect Fabric) that use ‘Chiplets’
• Advanced crosstalk
• Some final ‘tips’ and ‘tricks’
• Some useful contacts, sources, references and webinars

Please note that the Advanced EMC Course cannot be booked on its own. In order to take part in the Advanced EMC Course, you will first need to complete the Essential EMC Course.

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